2D非接觸式測(cè)厚機(jī) YL-881 Laser Vision Measurement 品管量測(cè)設(shè)備 產(chǎn)品特性（FEATURES） ◆使用Window’s視窗介面，中/英文化書面，操作簡(jiǎn)單。 ◆手動(dòng)量測(cè)錫膏厚度 ◆手動(dòng)測(cè)量長、寬及兩錫膏間之距離（間距） ◆測(cè)量值可記錄存檔及列印 ◆提供厚度分布統(tǒng)計(jì)圖表及X_Bar_R管制表 ◆自動(dòng)計(jì)算制程能力指標(biāo)CP、CPK、CPM ◆可依不同生產(chǎn)線分別作記錄 ◆可依基板厚度調(diào)整焦距 ◆可做定時(shí)呼叫取樣 ◆All operations are easy and using Windows interface in Chinese/English version. ◆Survey thickness of tin solder by auto matica lly or manually. ◆Survey the length and width manually,and the gap of tin solder. ◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically. ◆All surveyed values can be recorded to a file and be printed to a report. ◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R. ◆Calculate man facture ability degree automatically(CP, CPK, CPM) ◆It can have proprietary record according to every different production ling. ◆It can adjust focus point in different thickness of PC boards. ◆It can be called to sample periodically. 適用（APPLECATION） ◆各式厚度量測(cè)數(shù)值取得統(tǒng)計(jì)分析 ◆錫膏印刷機(jī)制程品管檢查 ◆錫膏印刷厚度良性測(cè)量 ◆錫膏印刷成型，尺寸量測(cè)檢查 ◆提供其他物品測(cè)厚，測(cè)長，量測(cè)檢查 ◆Get the results of statistics and analysis about all surveyed values in every thickness degree. ◆Inspect the quality of solder printing process. ◆Survey the thickness benignancy of tin solder ◆Measure the dimension of tin solder ◆Provide thickness and dimension measurement function for other objects 功能（FUNCTION） ◆量測(cè)印刷錫膏厚度、長度、高度、間距。 ◆提供厚度分布數(shù)值參考。 ◆提供各種統(tǒng)計(jì)分析圖表 X管制圖、 R管制圖、厚度列表 X平均值管制圖 單點(diǎn)列表 ◆Surveying the thickness of printing tin solder, length ,height and interval. ◆Provide the references of thickness distribution values. ◆Provide the analysis of different measure of cross