優勢供應樂泰UF3811,樂泰UF3808，樂泰UF3810，樂泰UF3800，樂泰77B填充膠深圳漢高樂泰銷售處，昆山樂泰，東莞樂泰，上海漢高樂泰銷售。致電陳生 137、5113、6332.Q.Q/30/22/24/564/ 網.址。w.w.w.a.a.l.o.c.t.i.t.e.c.o.m.
ECCOBOND EN 3810T ECCOBOND EN 3838T
LOCTITE ECCOBOND EN 3810T and LOCTITE?
ECCOBOND EN 3838T are primarily designed for
encapsulating components on a printed circuit
board (PCB). When cured, these materials provide
stable electronic performance in temperature/
humidity/bias testing. Both materials are designed
to be jet dispensible, and their thixotropic nature
allows for improved flow control and targeted
LOCTITE ECCOBOND UF 3811 is a reworkable epoxy
underfill designed for Chip-Scale Package (CSP) and
Ball Grid Array (BGA) applications. This low-viscosity
material is formulated to flow at room temperature
with no additional preheating required
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