186 Flux Pen®專為傳統和表面貼裝電路板組件的含鉛和無鉛返工而設計。

186根據MIL-F-14256，被QPL批準為RMA型。雖然助熔劑的能力接近于RA型焊劑，但釬焊后的殘留物無腐蝕性和不導電性。

186已開發用于焊接困難組件的關鍵應用，但工藝要求規定使用RMA型焊劑。

186具有較高的熱穩定性，用于焊接需要較高溫度的多層組件。暴露在高溫下不會降低殘渣在正常清洗溶劑中的溶解度。焊劑殘留物不會導致表面絕緣電阻退化。使用最少的離子活化劑和殘余物的非活性性質允許殘余物留在電路板組件上用于許多應用。助焊劑殘留物還具有防潮和抗zj性。

 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies.

186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.

186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.

186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.