田村 TAMURA 低銀錫膏GP-217-HF17  衡鵬企業(yè)竭誠(chéng)為您供應(yīng)




1. Outstanding Features
3) Stable printability and shape of the printed solder paste are obtained with little change in viscosity
during continuous printing.
* Inspected the flux itself only
reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no
halides, it can be remained on the PCB without cleaning.
LFSOLDER GP-217-HF17 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder
powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is
Table 1 - The characteristics of LFSOLDER GP-217-HF17
1) Pb-free (Sn/Ag/Cu series) alloy solder is used.
2) Excellent wettability for electronic component and land pattern.
4) Excellent solderability is brought with the reflow profile with high peak temperature.
5) Superior reliability is ensured without cleaning the flux residue.


Items                       Characteristics            Test methods
Alloy composition           Sn 96.1 / Ag 1.0 /         JIS Z 3282 (1999)
Melting point               211??222??                 DSC measurement
Particle size of solder     20??36μm                  Laser diffraction method
Shape of solder powder      Spherical                  Annex 1 to JIS Z 3284 (1994)
Flux content                12.5%                      JIS Z 3284 (1994)
Chlorine content*           0.0%                       JIS Z 3197 (1999)
Viscosity                   200 Pa??s                  Annex 6 to JIS Z 3284 (1994)