常州電磁式無源貼片蜂鳴器 SMD-090025H側發音 福鼎廠家直銷3V
描 述
A. SCOPE
This specification applies magnetic buzzer, SMD-090025H-03027
B. SPECIFICATION
|
No.
|
Item
|
Unit
|
Specification
|
Condition
|
|
1
|
Oscillation Frequency
|
Hz
|
2700
|
Vo-p=1/2duty , square wave
|
|
2
|
Operating Voltage
|
Vo-p
|
2 ~ 4
|
|
|
3
|
Rated Voltage
|
Vo-p
|
3
|
|
|
4
|
Current Consumption
|
mA
|
MAX. 100
|
at Rated Voltage
|
|
5
|
Sound Pressure Level
|
dB
|
MIN. 80
|
at 10cm at Rated Voltage
|
|
6
|
Coil Resistance
|
Ω
|
16±3
|
|
|
7
|
Operating Temperature
|
℃
|
-30 ~ +70
|
|
|
8
|
Storage Temperature
|
℃
|
-40 ~ +85
|
|
|
9
|
Dimension
|
mm
|
Φ9.0x H2.5
|
See appearance drawing
|
|
10
|
Weight (MAX)
|
gram
|
0.8
|
|
|
11
|
Housing Material
|
|
LCP( Black )
|
|
|
12
|
Leading Pin
|
|
Tin Plated Brass(Sn)
|
See appearance drawing
|
|
13
|
Environmental
Protection Regulation
|
|
RoHS
|
|
C. APPEARANCE DRAWING
Tol : ± 0.5 Unit: mm
D.TESTING METHOD
Standard Measurement conditions
Temperature:25±2℃ Humidity:45-65%
Acoustic Characteristics:
The oscillation frequency, current consumption and sound pressure are measured by the measuring instruments shown below
In the measuring test, buzzer is placed as follows:
E. Typical Frequency Response Curve
F. Recommend Driving Circuit
The base current Ib should high enough so that it saturates the collector current of the transistor with the CB load.
G. Soldering Condition
(1)Recommendable reflow soldering condition is as follows
(Reflow soldering is twice)
Note:It is requested that reflow soldering should be executed after heat of product goes down to normal.
Heat resistant line
(Used when heat resistant reliability test is performed)
(2)Manual soldering
Manual soldering temperature 350 ℃ within 5 sec.
H. RELIABILITY TEST
|
NO.
|
ITEM
|
TEST CONDITION AND REQUIREMENT
|
|
1
|
High Temperature
Test (Storage)
|
After being placed in a chamber with 85![]() 2℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: ![]() 10dB.
|
|
2
|
Low Temperature
Test (Storage)
|
After being Placed in a chamber with -40![]() 2℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: ![]() 10dB.
|
|
3
|
Humidity Test
|
After being Placed in a chamber with 90-95% R.H. at 40![]() 2℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: ![]() 10dB.
|
|
4
|
Temperature Cycle
Test
|
The part shall be subjected to 5 cycles. One cycle shall be consist of:
Allowable variation of SPL after test: ![]() 10dB.
|
|
5
|
Drop Test
|
Drop on a hard wood board of 4cm thick, any directions ,6 times, at the height of 75cm .
Allowable variation of SPL after test: ![]() 10dB.
|
|
6
|
Vibration Test
|
After being applied vibration of amplitude of 1.5mm with 10 to 55 Hz band of vibration frequency to each of 3 perpendicular directions for 2 hours .
Allowable variation of SPL after test: ![]() 10dB.
|
|
7
|
Solderability
Test
|
Lead terminals are immersed in rosin for 5 seconds and then immersed in solder bath of +300![]() 5℃ for 3![]() 1 seconds .
90% min. lead terminals shall be wet with solder
(Except the edge of terminals).
|
|
8
|
Terminal Strength
Pulling Test
|
The force of 9.8N(1.0kg) is applied to each terminal in axial direction for 10 seconds.
No visible damage and cutting off.
|
TEST CONDITION.
Standard Test Condition : a) Temperature : +5 ~ +35℃ b) Humidity : 45-85% c) Pressure : 860-1060mbar
Judgment Test Condition : a) Temperature : +25 ± 2℃ b) Humidity : 60-70% c) Pressure : 860-1060mbar
I. PACKING STANDARD
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